skip to content   skip to nav

• Customer Resource Center
• Request Quote / Sample / Info
• Contact Customer Service

• Home
• Capabilities & Services
  • Quick Turn Prototypes
  • Wafer Preparation
    • Backgrinding
    • Dicing
    • Additional Services
  • IC Packages
    • Open Cavity Plastic Packages
    • Open-molded Plastic Package (OmPP)
    • Ceramic
    • BGA Substrates
    • Custom Configurations
  • IC Assembly
    • Wire Bonding
    • Encapsulation Options
    • Marking/Branding
    • BGA Sphere Attach
  • Advanced Assembly
    • Chip on Board / Chip on Flex
    • Multi-Chip Module (MCM)
    • System in Package (SiP)
    • Flip Chip Bonding
    • Stacked Die
    • MEMS - Case Study
    • Thermal Chip Calibration Fab
  • Laser Micromachining
  • Design & Engineering
• News & Events
  • Company News
  • Schedule of Events
• Technical Information
  • Quik-Pak Datasheets
  • Technical Articles
  • Materials Information
  • Tech Tips
• About Us
  • Company Profile
  • Contact Information
  • Terms & Conditions

Quik-Pak Technical Datasheets

Backgrinding & Dicing

Open-molded Plastic Package (OmPP)®

Open-molded Plastic Packages Part Number Table

Open Cavity Plastic Packages (OCPP)®

Assembly Services

Encapsulation Options

Flip Chip & Advanced Assembly

Laser Micromachining

BGA Balling

Ceramic Packages


You will need Acrobat Reader to view the .pdf files above. Download Acrobat Reader ›