skip to content   skip to nav

• Request a Quote
• Contact Customer Service

• Home
• Capabilities & Services
  • Quick Turn Prototypes
  • Wafer Preparation
    • Backgrinding
    • Dicing
    • Additional Services
  • IC Packages
    • Open Cavity Plastic Packages
    • Ceramic
    • BGA Substrates
    • Custom Configurations
  • IC Assembly
    • Wire Bonding
    • Encapsulation Options
    • Marking/Branding
    • BGA Sphere Attach
  • Advanced Assembly
    • Flip Chip Bonding
    • Chip on Board / Chip on Flex
    • Multi-Chip Module (MCM)
    • System in Package (SiP)
    • Stacked Die
    • MEMS - Case Study
    • Radiation Detector Fabrication
    • Thermal Calibration Chip Fab
  • Flip Chip Bonding
  • Laser Micromachining
  • Radiation Detector Fabrication
  • Design & Engineering
• Technical Information
  • Quik-Pak Datasheets
  • Materials
  • Tech Tips
    • OCPP Storage
    • Ball Bonding
    • Encapsulation
    • Drying
  • Customer Resource Center
• News & Events
  • Company News
  • Schedule of Events
• About Us
  • Company Profile
  • Contact Information
  • Request a Quote
  • Terms & Conditions

Quik-Pak Data Sheets

Quik-Pak Advantage ›

Backgrinding & Dicing ›

Open Cavity Plastic Packages ›

Assembly Services ›

Encapsulation Options ›

Flip Chip & Advanced Assembly ›

Radiation Detector Fabrication ›

Laser Micromachining ›



You will need Acrobat Reader to view the .pdf files above. Download Acrobat Reader ›