Related Links
Encapsulation Options
Materials Data Sheets
QUIK-PAK NEWS
Quik-Pak Featured in US Tech Article
CZT Detectors: Converging assembly technologies open new application opportunities
Die Attach & Encapsulation Materials
Quik-Pak utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.
Die attach materials are available in:
Conductive
Non-Conductive
Super Thermally/Electrically Conductive
Lead-Free
Encapsulation epoxy is available in:
Standard Filled
Lead-Free
Low Stress (for large, thin parts)
Clear
When a specific die attach or encapsulation material is needed that is not listed as an option, the customer can provide it or contact Quik-Pak customer service.
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