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Encapsulation Options
Materials Data Sheets
QUIK-PAK NEWS
Technical Article: Gaining Time and Creativity without Compromise
Quik-Pak Announces Copper Wire Bonding Capability
Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family
Product/Service Spotlight
Quik-Pak offers QFN's with Largest Selection of 4mm PitchRequest a Quote
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Open-molded Plastic Packages (OmPP)™
Die Attach & Encapsulation Materials Information
Quik-Pak utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.
Die Attach Options:
Non-conductive
QMI538NB >Conductive
QMI529HT >H20E >
Super Thermally & Electrically Conductive
Diemat 6030 >Solder
Indium 6.3 >Encapsulation Options:
Standard
Hysol FP4323 >Low Stress
Hysol CB064/FP4653 >Clear
Resin Labs EP691 >When a specific die attach or encapsulation material is needed that is not listed as an option, the customer can provide it or contact Quik-Pak customer service.
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