QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Die Attach & Encapsulation Materials Information

Quik-Pak utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.

Die Attach Options

Non-conductive: Conductive: Super Thermally & Electrically Conductive: Solder:

Encapsulation Options

Standard: Low Stress:

Clear

  • Resin Labs EP691

    • If a specific die attach or encapsulation material is needed that is not listed as an option,  customer service can provide it. Contact Quik-Pak customer service.