QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Product Spotlight: Overmolded Packages

High Volume Plastic Overmolded Packages

Quik-Pak offers packaging and assembly for higher volume applications 

  • Overmolded metal leadframe arrays
  • Saw singulated chip scale packages including QFN and DFN
  • Wire bonded devices
  • Flip chip devices
  • For more information regarding our overmolding capabilities, contact our sales department.