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Quik-Pak IC Design,
Packaging and Prototyping
Firms Partner To Service Customers
in Europe
San Diego, CA, May 5, 2008 - Quik-Pak, a division of Delphon Industries, announced today that it will partner with UK based Optocap limited to provide European customers with a full turnkey solution for their IC packaging and prototyping needs. The two companies will co-exhibit at the upcoming IET & GSA International Semiconductor Forum in London, England May 14-15. Click here to read more
Quik-Pak Attains ISO
9001:2000 Certifcation
Quik-Pak, a division of Delphon Industries, announced today that it
has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services. Click here to read more
Quik-Pak Announces
Wafer Backgrinding Services
San Diego, August 21, 2007 - Quik-Pak, a division of Delphon
Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the installation of a new Disco Automatic Surface Grinding system. This equipment provides in-house capability to grind wafers up to 200mm in diameter down to a thickness of 150µm (6 mils), supporting the latest package technology and stacked die applications. This newest capital acquisition, along with a Royce Pick & Place system, scheduled for September installation, complements the existing Disco Automatic Wafer Dicing Saw and allows Quik-Pak to deliver complete wafer preparation services. Quik-Pak is also the world's largest supplier of open cavity plastic packages, that give IC designers the option to insert new die in existing production packages for design verification, testing and customer samples. Click here to read more
Quik-Pak Announces New Manufacturing Engineer
San Diego, August 1, 2007 - Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the hiring David Arciaga, as Manufacturing Engineer. "David brings with him 23 years of experience in the semiconductor industry and will be an invaluable addition to our Manufacturing Team," said Steve Swendrowski, General Manager of Quik-Pak. Click here to read more
Quik-Pak Announces New Applications Engineering Manager
San Diego, August 1, 2007 - Quik-Pak, a division of Delphon
Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the hiring of Matt Rackstein, as Applications Engineering Manager. Mr. Rackstein brings with him a wealth of expertise in the field of design engineering and MEMS (Mirco Electro Mechanical Systmes). Development. "Matt will make an excellent addition to our team. His vast experience in our market will help Quik-Pak better serve its customer especially in the areas of wafer backgrinding and dicing" said Steve Swendrowski, General Manager of Quik-Pak. Click here to read more
Quik-Pak is proud to be a sponsor of the SRC/SIA 2007-2008 IC Design Challenge
Quik-Pak is proud to be a sponsor of the SRC/SIA 2007-2008 IC Design Challenge. 47 university teams from 28 universities have been selected to participate in this event. These teams will compete for a total of $18,000 in cash prizes in Phase One and the opportunity to fabricate their designs using Jazz Semiconductor's 180nm SiGe technology. In the next six months, these teams will complete their designs, including verification with simulations and preliminary layouts, submitting their reports by February 20, 2008. The top five teams will be selected from these submissions and continue to Phase Two of the contest where they will complete their layouts, and fabricate and verify their designs. Phase Two winners will share a total of $50,000 in cash prizes. For more
information, please visit www.src.org/ICcontest/teams.asp.
Ready for IBM Technology
Quik-Pak is validated as ready for IBM Technology. The Ready for IBM Technology mark signifies which IBM Business Partner offerings have been validated by the Business Partner as compatible with one of more of IBM's foundry technologies.
Quik-Pak to Host Local
IMAPS Meeting
San Diego, Calif., June 13, 2007 - Quik-Pak, a division of Delphon,
will be hosting a local IMAPS meeting at their newly remodeled facility on June 26th. For more details, click here.
Parent Company Receives
Best Practices Award
Delphon awarded Best Practces For Fostering Employee Health
and Well-being. read more
Quik-Pak Announces New BGA Service
San Diego, CA, April 11, 2007 - Quik-Pak, a division of Delphon
Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced the installation of a new process line for Ball Grid Array(BGA) sphere attach. read more
Quik-Pak Announces Installation of Wafer Dicing Saw
San Diego, CA, October 31, 2006 - Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced the installation of a new 200mmm Disco Automatic Wafer Dicing Saw in it's recently expanded facilities in San Diego. read more
Quik-Pak Announces Expansion Plans
San Diego, CA, September 6, 2006 - Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced that construction is underway for a 5,000 square foot expansion of its current facilities. The addition will include both manufacturing and office space to support growth of Quik-Pak's prototype package and assembly services. The expansion is projected to be completed by early November of this year. For further information, contact Quik-Pak, 10987 Via Frontera, San Diego, CA 92127, phone (858) 674-4676, moreinfo@icproto.com.
Quik-Pak Announces
Quik-Pak announces that it has used its patented open-cavity process to successfully open a new generation of dual row MLF packages. read more
Quik-Pak In The News
Advanced Packaging recently featured our article Prototype Packaging Solutions for IC Designers on their website. read more
Quik-Pak Seeing Upward Trend in Demand
The demand for open-cavity chip scale packages (e.g. MLF, LPCC, MLP, etc) and assembly services from Quik-Pak is on the rise. More and more companies are discovering that Quik-Pak's ability to provide this service on a same day basis is an ideal fit for their I.C. Design program. No minimal order quantities are required.
I.C. Design Engineers and Program Managers find the use of these popular Plastic packages advantageous over ceramic substitutes, or substitute plastic package equivalents. Prototyping in the same package as intended for Production is ideal.
Quick Solutions for IC Designers
IC designers can now bid farewell to their headaches when verifying their designs. Quik-Pak offers unlimited open cavity plastic IC packages for convenient assembly of prototype semiconductor die. read more
Quik-Pak In The News
U.S. Tech magazine carried our story about Quick Solutions for IC Designers. The article also appeared on the US Tech Web site. read more
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Ph: 858 674-4676
