QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Company News

Quik-Pak Wins IMAPS 2016 Corporate Recognition Award for Significant Technical Contributions to the Microelectronics Industry

SAN DIEGO, CA – SEPTEMBER 11, 2016: Quik-Pak, a provider of microelectronic chip packaging and assembly solutions, will receive the International Microelectronics Assembly and Packaging Society (IMAPS) 2016 Corporate Recognition Award at the industry organization’s 49th International Symposium on Microelectronics on October 11, 2016 in Pasadena, Calif.

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Quik-Pak Supports Advances in Semiconductor Packaging at IMAPS Events

SANTA CLARA, CA – AUGUST 23, 2016: IC Packaging Solutions Provider/IMAPS Premier Corporate Member Sponsors Technical Presentation in San Diego Aug. 23, Exhibits at IMAPS Technology Workshop in New York Sept. 22, 2016.

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Promex, Quik-Pak Showcase Expertise in Medtech Device Packaging & Assembly, Exhibit Air Cavity QFNs, Over Molded DFN / QFNs

SANTA CLARA, CA – JUNE 30, 2016: Microelectronics Services Providers to Promote Capabilities Designed to Accelerate Time to Market at MEPTEC Medical Electronics Symposium in Portland, OR, September 14‐15, 2016

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Quik-Pak Exhibits Open-Molded Plastic Packages, Air Cavity QFNs at International Microwave Symposium

SAN DIEGO, CA – MAY 23, 2016: Quik-Pak will showcase its Open-molded Plastic Packages (OmPP) for microwave and RF applications in Booth 2229 at the International Microwave Symposium (IMS), May 22-27 in San Francisco, California.

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Promex Showcases Fast-Track Concept-to-Production Electronic Manufacturing Services at MD&M West Expo

SANTA CLARA, CA – FEBRUARY 9, 2016: Promex Industries Inc., a provider of engineering and mixed technology contract electronic manufacturing services, will demonstrate how it fast tracks medical and bioscience products from concept to production in Booth 480 at the Medical Device and Manufacturing West Expo, February 9-11 in Anaheim, Calif.

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Quik-Pak, Promex Combine Forces to Bring Wireless Medical Devices to Market Faster

SAN DIEGO, CA, JANUARY 27, 2016: Quik-Pak, a quick-turn prototype specialist for medical devices, is co-exhibiting with its parent company Promex Industries Inc., an electronic manufacturing services (EMS) provider that integrates conventional SMT with semiconductor microelectronic packaging and assembly.

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Promex Industries Acquires Quik-Pak, a Division of Delphon

SANTA CLARA, CA, APRIL 1 2015:  Promex Industries, announced today the acquisition of San Diego based Quik-Pak, a division of Delphon. 

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Product Spotlight: Quik-Pak offers High Volume Plastic Overmolded Packages

San Diego, CA September 1, 2014:  Quik-Pak offers packaging and assembly for high volume applications.  

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Quik-Pak Promotes Casey Krawiec to Global Sales and Marketing Director

San Diego, CA April 30, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director.

To read full press release, click here.  


Quik-Pak Selected to Provide Enhanced Molding and Assembly Services to Wireless Semiconductor and Solar Customers

San Diego, CA April 10, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries.

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Product Spotlight: Custom Open-molded QFN Packages (OmPP)

Hayward, CA April 4, 2014: Quik-Pak understands that the package is an integral part of the design process. Occasionally, the need arises for a specific footprint or lead count and a custom tooled package is the best option. That is why Quik-Pak offers custom molded QFN packages. These QFN packages can be tooled to meet the specific needs of your application.

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Quik-Pak Expands NEW Open-molded Plastic Package (OmPP)® Product Family with 8-Lead SOIC

San Diego, CA, September 18, 2012:  Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announces its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)® product line.

To read the full press release, click here.


Product Spotlight: OmPP for Design Engineers

San Diego, CA, July 1, 2013: For design engineers that are required to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages(Open-molded Plastic Packages) provide a cost effective solution. Continue reading.


Product Spotlight: Stacked Die

San Diego, CA, May 1, 2013: Quik-Pak understands that today’s smaller, lighter technologies demand that you conserve real estate on the printed circuit board and simplify the board assembly process. Continue reading.


Product Spotlight: Flip Chip

San Diego, CA, April 1, 2013: Quik-Pak is a leading provider of Flip Chip Assembly Services for microelectronic device applications requiring a small footprint and short interconnects. Assembly applications include µBGA, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more. Continue reading.


Product Spotlight: Wafer Dicing

San Diego, CA, March 1, 2013: Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day! Continue reading.


Quik-Pak Announces Copper Wire Bonding

San Diego, CA, December 15, 2011:  Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder. 

To read the full press release, click here


Quik-Pak Presented at this year’s TowerJazz Global Symposium Aerospace and Defense Day

San Diego, CA, December 14, 2011: Casey Krawiec, Global Sales and Marketing Manager for Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, presented on Aerospace and Defense Day, November 2nd, at the TowerJazz Global Symposium.  The title of his presentation was, "Enabling Innovation". 

Download Quik-Pak Presentation


Quik-Pak Awarded Plaque by IMAPS

San Diego, CA, September 27 2011:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, was awarded a plaque today by the International Microelectronics and Packaging Society (IMAPS) for their support as a premier corporate member of the organization. 

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Quik-Pak Expands Open-molded Plastic Package (OmPP) Product Family

San Diego, CA, June 1st 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly announced today its exclusive Open-molded Plastic Package (Ompp)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs. 

To read the full press release, click here


Delphon Announces Partnership with Neu Dynamics Corporation

Hayward, CA, May 5th, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and insert molding to the Semiconductor, Medical and Automotive industries for over 30 years. 

To read the full press release, click here


Quik-Pak Announces Open-molded Plastic Packages (OmPP)

San Diego, CA, April 12, 2011:Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an exclusive Open-molded Plastic Package (OmPP)™. A pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs. 

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Quik-Pak Offers Innovative Approach to Bumping Single Die

San Diego, CA, March 3, 2011: Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an innovative approach to prototype die bumping. 

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Quik-Pak Hosts IMAPS Event at San Diego Offices

San Diego, CA, Febuary 4 2011:Quik-Pak Hosts IMAPS Event About the Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology. IMAPS Event begins on Tuesday, February 22 at 12:00.

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Quik-Pak Enhances Die Bonding Capabilities

San Diego, CA, November 10, 2010:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has expanded its services to include submicron placement accuracy as part of its flip chip bonding capabilities.
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Quik-Pak Hosts IMAPS Technical Presentation on the Challenges of Die Stacking

San Diegom CA, October 26 2010: The technical presentation addresses the status of die stacking in the industry and the challenges of die stacking, especially for RF devices. Skyworks Solutions has reduced die sizes for silicon and GaAs, introduced the smallest component sizes called “01005”, and has shrunk the available gaps between the wires, die, & components used in the RF modules.

Mark Kuhlman a Senior Principal Engineer at Skyworks Solutions led the presentation.

www.imaps.com


Quik-Pak Announces Agreement with Ultra Communications Inc.

San Diego, CA, October 10, 2010: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has entered into a contract with UltraComm for the packaging and assembly of electro/optic Cores. 

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US Tech: Selling Time without Compromise

February 2010:  Julie Adams,  Quik-Pak Sales Director, discusses "selling time" in the Feb. issue of US Tech.

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Semiconductor Packaging News

January 12, 2010: Jeanne Beacham, Delphon CEO, discusses her outlook on 2010 in Semiconductor Packaging News Viewpoint Article.

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Chip Scale Review:  CZT Detectors: Converging Assembly Technologies Open Application Opportunities

November 2009: Infrastructure Advisor's  Ron Lecke and Quik-Pak's Howard Lenos discuss the latest in CZT Detector Assembly.

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Quik-Pak Announces ITAR Registration

San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military Affairs. 

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Quik-Pak Completes New Expansion

San Diego, CA, April 16, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced the completion of its new expanded facility today. The company has added 5,800 sq ft of new clean manufacturing space which houses advanced substrate manufacturing and IC package assembly operations. 

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Quik-Pak Launches New Website

San Diego, CA, February 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today. The site was developed to more effectively deliver technical information regarding the company’s increased service offering such as Flip Chip assembly and Laser Micromachining.


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Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies

San Diego, CA, September 25, 2008: Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services.

To read the full press release, click here



GSA Suppliers Expo Provides Optimal Opportunity for the Semiconductor Industry to View Innovative Solutions from Quik-Pak

San Diego, CA, September 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will exhibit at the upcoming GSA Suppliers Expo October 2, 2008. The company plans on showing conference attendees its full turnkey solutions for their IC packaging and prototyping needs.

To read the full press release, click here



Quik-Pak Attains ISO 9001:2000 Certification

San Diego, CA, March 28, 2008: Quik-Pak, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services.

To read the full press release, click here