Company News

US Tech: Selling Time without Compromise

February 2010: Julie Adams, Quik-Pak Sales Director, discusses "selling time" in the Feb. issue of US Tech.

Semiconductor Packaging News

January 12, 2010: Jeanne Beacham, Delphon CEO, discusses her outlook on 2010 in Semiconductor Packaging News Viewpoint Article.

Read Full Article >

Chip Scale Review: CZT Detectors: Converging assembly technologies open application opportunities

November 2009: Infrastructure Advisor's Ron Lecke and Quik-Pak's Howard Lenos discuss the latest in CZT Detector Assembly.

Read Full Article >

Quik-Pak Names World Wide Sales Director

San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today the appointment of Julie Adams as Worldwide Sales Director.

Read Full Press Release ›

Quik-Pak Announces ITAR Registration

San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military Affairs.

Read Full Press Release ›

Quik-Pak Completes New Expansion

San Diego, CA, April 16, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced the completion of its new expanded facility today. The company has added 5,800 sq ft of new clean manufacturing space which houses advanced substrate manufacturing and IC package assembly operations.

Read Full Press Release ›

Quik-Pak Launches New Website

San Diego, CA, February 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today. The site was developed to more effectively deliver technical information regarding the company’s increased service offering such as Flip Chip assembly and Laser Micromachining.

Read Full Press Release ›

Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies

San Diego, CA, September 25, 2008: Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services.

Read Full Press Release ›

GSA Suppliers Expo Provides Optimal Opportunity for the Semiconductor industry to View Innovative Solutions from Quik-Pak

San Diego, CA, September 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will exhibit at the upcoming GSA Suppliers Expo October 2, 2008. The company plans on showing conference attendees its full turnkey solutions for their IC packaging and prototyping needs.

Read Full Press Release ›

Quik-Pak Attains ISO 9001:2000 Certification

San Diego, CA, March 28, 2008: Quik-Pak, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services.

Read Full Press Release ›