Company News
Quik-Pak Expands NEW Open-molded Plastic Package (OmPP)® Product Family with 8-Lead SOIC
San Diego, CA, September 18, 2012, - Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announces its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)® product line.
To read the full press release, click here.
Delphon Promotes Darby Davis to Vice President of Sales and Marketing
Hayward, CA, May 1, 2012: Delphon, a worldwide provider of high-quality, innovative products and services to high-technology companies, today announced the promotion of Darby Davis to Vice President, Sales and Marketing.
To read the full press release, click here.
Delphon Appoints Rajesh Varma Director of Marketing and Technology Development
Hayward, CA, May 1, 2012: Delphon, a worldwide provider of high-quality, innovative products and services to high-technology companies, today announced the appointment of Rajesh Varma to Director of Market and Technology Development. He will support all four of Delphon’s divisions, including Gel-Pak, Quik-Pak, UltraTape, and TouchMark. Rajesh will bring his broad industry background to promote the Delphon’s wide variety of unique materials and solutions to new applications and markets.
To read the full press release, click here.
Quik-Pak Announces Copper Wire Bonding
San Diego, CA, December 15, 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder.
To read the full press release, click here.
Quik-Pak Presented at this year’s TowerJazz Global Symposium Aerospace and Defense Day
San Diego, CA, December 14, 2011: Casey Krawiec, Global Sales and Marketing Manager for Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, presented on Aerospace and Defense Day, November 2nd, at the TowerJazz Global Symposium. The title of his presentation was, "Enabling Innovation".Download Quik-Pak Presentation
Jeanne Beacham of Delphon Industries Receives Two Prestigious Awards
To read the full article, click here.
Quik-Pak Awarded Plaque by IMAPS
San Diego, CA, September 27 2011:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, was awarded a plaque today by the International Microelectronics and Packaging Society (IMAPS) for their support as a premier corporate member of the organization.
To read the full press release, click here.
Quik-Pak Expands Open-molded Plastic Package (OmPP) Product Family
San Diego, CA, June 1st 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly announced today its exclusive Open-molded Plastic Package (Ompp)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs.
To read the full press release, click here.
Delphon Announces Partnership with Neu Dynamics Corporation
Hayward, CA, May 5th, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and insert molding to the Semiconductor, Medical and Automotive industries for over 30 years.
To read the full press release, click here.
Quik-Pak Announces Open-molded Plastic Packages (OmPP)
San Diego, CA, April 12, 2011:Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an exclusive Open-molded Plastic Package (OmPP)™. A pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs.
Read Full Press Release ›Quik-Pak Offers Innovative Approach to Bumping Single Die
San Diego, CA, March 3, 2011: Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an innovative approach to prototype die bumping.
To read full press release, click here.
Quik-Pak Hosts IMAPS Event at San Diego Offices
San Diego, CA, Febuary 4 2011:Quik-Pak Hosts IMAPS Event About the Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology. IMAPS Event begins on Tuesday, February 22 at 12:00.Read Full Press Release ›
Quik-Pak Enhances Die Bonding Capabilities
San Diego, CA, November 10, 2010:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has expanded its services to include submicron placement accuracy as part of its flip chip bonding capabilities.To read the full article, click here.
Quik-Pak Hosts IMAPS Technical Presentation on the Challenges of Die Stacking
San Diegom CA, October 26 2010: The technical presentation addresses the status of die stacking in the industry and the challenges of die stacking, especially for RF devices. Skyworks Solutions has reduced die sizes for silicon and GaAs, introduced the smallest component sizes called “01005”, and has shrunk the available gaps between the wires, die, & components used in the RF modules.
Mark Kuhlman a Senior Principal Engineer at Skyworks Solutions led the presentation.
Quik-Pak Announces Agreement with Ultra Communications Inc.
San Diego, CA, October 10, 2010: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has entered into a contract with UltraComm for the packaging and assembly of electro/optic Cores.
To read the full press release, click here.
US Tech: Selling Time without Compromise
February 2010: Julie Adams, Quik-Pak Sales Director, discusses "selling time" in the Feb. issue of US Tech.
Semiconductor Packaging News
January 12, 2010: Jeanne Beacham, Delphon CEO, discusses her outlook on 2010 in Semiconductor Packaging News Viewpoint Article.
Read Full Article >Chip Scale Review: CZT Detectors: Converging Assembly Technologies Open Application Opportunities
November 2009: Infrastructure Advisor's Ron Lecke and Quik-Pak's Howard Lenos discuss the latest in CZT Detector Assembly.
Quik-Pak Announces ITAR Registration
San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military Affairs.
To read the full press release, click here.
Quik-Pak Completes New Expansion
San Diego, CA, April 16, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced the completion of its new expanded facility today. The company has added 5,800 sq ft of new clean manufacturing space which houses advanced substrate manufacturing and IC package assembly operations.
To read the full press release, click here.
Quik-Pak Launches New Website
San Diego, CA, February 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today. The site was developed to more effectively deliver technical information regarding the company’s increased service offering such as Flip Chip assembly and Laser Micromachining.
To read the full press release, click here.
Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies
San Diego, CA, September 25, 2008: Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services.
To read the full press release, click here.
GSA Suppliers Expo Provides Optimal Opportunity for the Semiconductor Industry to View Innovative Solutions from Quik-Pak
San Diego, CA, September 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will exhibit at the upcoming GSA Suppliers Expo October 2, 2008. The company plans on showing conference attendees its full turnkey solutions for their IC packaging and prototyping needs.
To read the full press release, click here.
Quik-Pak Attains ISO 9001:2000 Certification
San Diego, CA, March 28, 2008: Quik-Pak, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services.
To read the full press release, click here.
