DatasheetsWafer Backgrinding & Dicing
MIL STD 883G
Quick LinksRequest a Quote
OmPP® Quote or Sample
Contact Customer Service
Past Technical Articles
Product SpotlightNew product and services video to view Click Here
Wafer DicingQuik-Pak can precisely dice your Silicon Carbide, (SiC) or GaN wafers, as large as 300mm, utilizing the Disco DAD-3350 Automatic Dicing Saw. Multi-project (MPW), pizza wafers and reticles are easily accommodated—isolating only the dice you need. Quik-Pak can also wafer dice partial wafers and bumped wafers, as well as substrates or panels in other materials such as laminates, ceramic, glass or quartz. For very thin wafer applications, Quik-Pak utilizes the dice-before-backgrind process to singulate die before thinning down to as little as 50μm.
Following wafer dicing, Quik-Pak can assemble your dice into open cavity plastic packages, ceramic packages or substrates, sort the dice from a wafer map or ink dots into Gel-Pak or waffle trays, or leave the sawn wafer on tape for future assembly requirements.
Silicon Carbide (SiC) semiconductors can operate at substantially higher temperatures, voltages, and power levels than silicon-based semiconductors. The combination of these strengths translates into smaller, lighter, and simpler electrical systems. Silicon Carbide is very hard requiring special dicing processes and parameters. Quik-Pak utilizes the latest dicing technology from DISCO to efficiently dice this material.
Contact Quik-Pak sales for more information on wafer dicing.
Additional services provided by Quik-Pak include: