QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Wafer Dicing

Quik-Pak can precisely dice your silicon or GaN wafers, as large as 300mm, utilizing the Disco DAD-3350 Automatic Dicing Saw. Multi-project (MPW), pizza wafers and reticles are easily accommodated—isolating only the dice you need. Quik-Pak also processes partial wafers and bumped wafers, as well as substrates or panels in other materials such as laminates, ceramic, glass or quartz. For very thin wafer applications, Quik-Pak utilizes the dice-before-backgrind process to singulate die before thinning down to as little as 50μm.

Following dicing, Quik-Pak can assemble your dice into open cavity plastic packages, ceramic packages or substrates, sort the dice from a wafer map or ink dots into Gel-Pak or waffle trays, or leave the sawn wafer on tape for future assembly requirements.

Additional wafer preparation services offered by Quik-Pak include: