DatasheetsWafer Backgrinding & Dicing
MIL STD 883G
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Wafer BackgrindingTo meet the requirements of the latest ultra-thin packages, Quik-Pak can grind wafers down to as little as 50μm, utilizing the Disco DAG-810 Automatic Surface Grinder with Poligrind technology. Poligrind reduces surface roughness, improves die strength and reduces wafer warpage.
Quik-Pak can backgrind wafers up to 300mm in diameter, as well as partial wafers, bumped wafers and even individual die. In addition to silicon, materials such as glass, quartz and ceramic can also be thinned and polished.
Additional wafer preparation services offered by Quik-Pak include: