QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Additional Wafer Preparation Services

In addition to wafer backgrinding and dicing, Quik-Pak offers a range of other services to further process your valuable dice.

Die Sort / Pick & Place

Following dicing, Quik-Pak can select specific die to assemble into our open cavity plastic packages, and place the rest in Gel-Pak boxes or waffle packs or leave them on tape for future assembly builds. Utilizing an electronic wafer map from probing or ink-dot recognition, Quik-Pak’s Royce Auto-Placer MP300 can sort dice into the media of your choice.

For more information about Gel-Pak, please visit www.gelpak.com.

Inspection

Trained inspectors will examine your dice to your specifications, or MIL STD 883G, and isolate rejects from acceptable dice.

Wafer Washing

Should you require wafer washing to remove debris or contaminants, Quik-Pak can process your wafers through the Disco DCS-141 Fully Automatic High Pressure Wafer and Substrate Washing Station.

Additional wafer preparation services offered by Quik-Pak include:
  • Backgrinding or Thinning
  • Individual Die Thinning
  • Wafer Bumping

Contact Quik-Pak for any unique wafer preparation needs you may have.