Wafer Preparation
Quik-Pak delivers complete wafer preparation services for wafers up to 300mm. Wafer Preparation services are offered as part of your turnkey packaging and assembly project or as stand-alone services based on your individual needs. Quik-Pak utilizes state-of-the-art equipment from Disco, Ultron and Royce to offer the following services, which are performed in-house in as little as one day:
- Wafer Backgrinding or Thinning
- Dicing of silicon, glass, quartz, laminate, ceramic and panels
- Dicing of Multi Project Wafers (MPW), pizza wafers and reticles
- Die Sort or Pick & Place
- Inspection to MIL STD 883G
- Individual Die Thinning
- Wafer Washing
Site created by Take Flight Graphics 