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Quik-Pak Featured in US Tech Article

CZT Detectors: Converging assembly technologies open new application opportunities

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Quick Turn Prototypes

Quik-Pak, as our name implies, specializes in rapid prototyping services to all sectors of the semiconductor industry, providing Open Cavity Plastic Packages and assembled devices in as little as 24 hours or less.

When you have an urgent deadline to meet, Quik-Pak can receive a wafer in the morning, backgrind and dice, prepare open cavity packages, assemble and ship finished parts that same day.

If you have a little more time in your prototyping schedule, our standard lead times of 5 business days for package preparation and 3 business days for assembly are an economical, on-shore solution.

Products and services provided by Quik-Pak include:

Open Cavity Plastic Packages
Wafer Backgrinding or Thinning
Wafer Dicing
Die Sort & Inspection
Die Attach
Gold Ball Wire Bonding
Encapsulation
Flattening / Remolding
Marking/Branding
BGA Ball Attach
Custom Assembly