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Air Cavity QFN Packages
Open-molded Plastic Packages (OmPP)®
Quik-Pak’s exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs.
These QFN packages or open-molded plastic packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.
Pre-Molded Air Cavity QFN Package Advantages:
- RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
- Gold Plated QFN Packages
- Superior Bondability
- Custom QFN Body Sizes and Lead Counts available off the shelf
Pre-Molded Air Cavity QFN Packages Offer Flexibility
Quik-Pak’s Au/Ni plated QFN Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.
Quik-Pak’s new OmPP air cavity packages are production quality and are available for rapid delivery to meet customers needs.
Open-molded Plastic Package QFN Drawings
Quik-Pak’s new line of Open-molded Plastic Packages (OmPP) includes 28 open-tooled QFN packages meeting JEDEC foot prints for package bodies ranging from 3mm square to 12mm square. What if you like the size but want a custom I/O or paddle pattern? Quik-Pak can provide custom QFN packages for low NRE charges.
For example, suppose you want a 3mm square DFN instead of one of our standard QFN packages. We can do it.
Suppose you want to simulate package designs with high frequency transmission lines and then have someone build the package. We can do it.
Quik-Pak is your source for microelectronic IC packaging and IC assembly solutions.
- Wafer Dicing
- Wire Bonding
- Complete IC Assembly
- Custom IC Packaging
- Patented Open Cavity Plastic Packages (OCPP)
Air Cavity Lids
Quik-Pak offers matching lids for our new line of open cavity packages called Open-molded Plastic Packages. Our standard flat lids are made from 91% alumina ceramic. We also have flat, plastic lids made from the same RoHS and REACH compliant plastic that we use to make our QFN packages. If you want to seal your IC packages, we can add a B-stage epoxy ring to the lid.
Optional lid materials include:
Quik-Pak, well known for our quick-turn, prototype services, also offers assembly services for volume production runs. Wirebonding capacity was recently expanded with the purchase of a K&S IConn wirebonder and a Datacon EVO die bonder.
The expanded assembly capacity complements our new line of QFN packages, which are especially well-suited to volume production in the leadframe (array) format.
Quik-Pak offers a complete turnkey assembly solution including: