QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Open Cavity Plastic Packages (OCPP)

Open Cavity Plastic Packages (OCPP)
   Open Cavity Plastic Packages
 (OCPP)
 

Open Cavity Plastic Packages (OCPP) are the ideal platform for new IC prototypes, because they are mechanically and electrically identical to your future transfer molded production parts. Quik-Pak can convert any existing IC plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be assembled with your new die.

Quik-Pak’s proprietary reconfiguration process is applicable to packages that you provide or we procure for you, in any size or lead count. Available IC package types include:

Quik-Pak also provides complete: