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Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC
Open Cavity Plastic Packages (OCPP)
Open Cavity Plastic Packages (OCPP) are the ideal platform for new IC prototypes, because they are mechanically and electrically identical to your future transfer molded production parts. Quik-Pak can convert any existing plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be assembled with your new die. Quik-Pak’s proprietary reconfiguration process is applicable to packages that you provide or we procure for you, in any size or lead count. Available package types include:
- BGA (also see Laminate Substrates)
- DIP
- MLF / MLP / QFN / DFN / LPCC, Open-molded Plastic Packages (OmPP)
- PLCC
- QFP / LQFP / PQFP / TQFP
- SSOP / TSOP / TSSOP / SOIC / SOJ / MSOP / QSOP
- SOT / SC / TO / DPAK
Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.
