Datasheets
Open Cavity Plastic PackagesQUIK-PAK NEWS
Technical Article: Gaining Time and Creativity without Compromise
Quik-Pak Announces Copper Wire Bonding Capability
Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family
Product/Service Spotlight
Quik-Pak offers QFN's with Largest Selection of 4mm PitchRequest a Quote
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Open-molded Plastic Packages (OmPP)™
Open Cavity Plastic Packages (OCPP)
Open Cavity Plastic Packages (OCPP) are the ideal platform for new IC prototypes, because they are mechanically and electrically identical to your future transfer molded production parts. Quik-Pak can convert any existing plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be assembled with your new die. Quik-Pak’s proprietary reconfiguration process is applicable to packages that you provide or we procure for you, in any size or lead count. Available package types include:
- BGA (also see Laminate Substrates)
- DIP
- MLF / MLP / QFN / DFN / LPCC (also see Open-molded Plastic Packages OmPP)
- PLCC
- QFP / LQFP / PQFP / TQFP
- SSOP / TSOP / TSSOP / SOIC / SOJ / MSOP / QSOP
- SOT / SC / TO / DPAK
Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.
