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Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

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Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

Laser Micromachining

Quik-Pak utilizes the ESI 5150 Laser Processing System to provide micromachining services for custom electronic packaging and a limitless range of other applications. This ultra-precision ND:YAG laser system cuts, shapes and marks just about any material including:

Plastics
Laminates
Composites
Glass
Ceramics
Silicon wafers
Metals, including copper and stainless steel

The laser micromachining system can be programmed to:

Drill microvias as small as 25µm in diameter
Cut grooves, steps, channels, slots or cavities
Scribe alphanumeric characters, logos or alignment features
Create precision polymeric or metallic stencils and masks
Rework and repair rigid and flex printed circuits
Trim, drill and dice MEMS devices
Remove solder mask to create precise pads on printed circuits or other components
Drill precision alignment holes

Quik-Pak can accommodate parts up to 21" x 25" x 0.75" thick and can accept drawing files in AutoCAD (.dxf or .dwg) and Gerber (.gbr) formats for processing.