Datasheets
Laser MicromachiningQUIK-PAK NEWS
Technical Article: Gaining Time and Creativity without Compromise
Quik-Pak Announces Copper Wire Bonding Capability
Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family
Product/Service Spotlight
Quik-Pak offers QFN's with Largest Selection of 4mm PitchRequest a Quote
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Open-molded Plastic Packages (OmPP)™
Custom IC Package Configurations
In order to accommodate your unique packaging needs, Quik-Pak uses a variety of techniques to adapt and modify existing packages.
Our Laser Micromachining system can create precision fiducials, holes, slots, channels, grooves, steps and cavities into just about any material.
Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.
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