Quick Links

Request a Quote
OmPP® Quote or Sample
Contact Customer Service
Past Technical Articles
Customer Login

Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

New product and services video to view Click Here

Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

Quik-Pak Provides Custom Package Configurations

Custom IC Package Configurations

In order to accommodate your unique packaging needs, Quik-Pak uses a variety of techniques to adapt and modify existing packages.

Our Laser Micromachining system can create precision fiducials, holes, slots, channels, grooves, steps and cavities into just about any material.

Additional services provided by Quik-Pak include:

Prototype Assembly Services
Wafer Preparation
Die Bonding
Wire Bonding
Encapsulation
Flattening/Remolding
Marking/Branding