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Quik-Pak Featured in US Tech Article

CZT Detectors: Converging assembly technologies open new application opportunities

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Custom Package Configurations

In order to accommodate your unique packaging needs, Quik-Pak uses a variety of techniques to adapt and modify existing packages. Our Laser Micromachining system can create precision fiducials, holes, slots, channels, grooves, steps and cavities into just about any material.

Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.