QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services
Quik-Pak Provides Custom Package Configurations

Custom IC Package Configurations


In order to accommodate your unique packaging needs, Quik-Pak uses a variety of techniques to adapt and modify existing packages.

Our Laser Micromachining system can create precision fiducials, holes, slots, channels, grooves, steps and cavities into just about any material.

 

 

 

 

Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.