QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services
Ceramic Packages

Ceramic IC Packages



When ceramic packages are the right vehicle for your prototype devices, Quik-Pak can provide a full turnkey solution. We will procure the packages from industry-leading ceramic suppliers and assemble your devices to your specifications.

Packages are available with a variety of lids including taped-on, ceramic, combo, glass and hermetically sealed.

 

 

 


Quik-Pak provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, and Marking/Branding.