Datasheets

QUIK-PAK NEWS

Technical Article: Gaining Time and Creativity without Compromise

Quik-Pak Announces Copper Wire Bonding Capability

Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family

Product/Service Spotlight

Quik-Pak offers QFN's with Largest Selection of 4mm Pitch

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Open-molded Plastic Packages (OmPP)™

Ceramic IC Packages

When ceramic packages are the right vehicle for your prototype devices, Quik-Pak can provide a full turnkey solution. We will procure the packages from industry-leading ceramic suppliers and assemble your devices to your specifications.

Packages are available with a variety of lids including taped-on, ceramic, combo, glass and hermetically sealed.

Quik-Pak provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, and Marking/Branding.