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Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

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Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

Ceramic IC Packages

When ceramic packages are the right vehicle for your prototype devices, Quik-Pak can provide a full turnkey solution. We will procure the packages from industry-leading ceramic suppliers and assemble your devices to your specifications.

Packages are available with a variety of lids including taped-on, ceramic, combo, glass and hermetically sealed.

Additional services provided by Quik-Pak include:

Prototype Assembly Services
Wafer Preparation
Die Bonding
Wire Bonding
Marking/Branding