QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services
Laminate Substrates

Laminate Substrates


If your design project calls for the development of a custom BGA, interposer or other laminate substrate along with assembly services, Quik-Pak is the answer. 

We will coordinate the design and fabrication of your substrate, attach and wire bond your die, encapsulate, mark and attach the solder spheres.

Quik-Pak is the solution for all of your laminate substrate assembly needs. If you have substrates, we can deliver the assembly services to complete your devices, including solder sphere attach.

For more information about BGA Sphere Attach Click Here

 

 

 

Quik-Pak can also provide complete Wafer Preparation Services including Backgrinding, Dicing, and Die Sort.