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Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

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Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

Laminate Substrates

If your design project calls for the development of a custom BGA, interposer or other laminate substrate along with assembly services, Quik-Pak is the answer.

We will coordinate the design and fabrication of your substrate, attach and wire bond your die, encapsulate, mark and attach the solder spheres.

Quik-Pak is the solution for all of your laminate substrate assembly needs. If you have substrates, we can deliver the assembly services to complete your devices, including solder sphere attach.

Additional services provided by Quik-Pak include: