IC Packages
Quik-Pak can provide virtually any package you need for your prototype devices, such as Open Cavity Plastic (OCPP), ceramic, laminate substrates and even custom package configurations.
If you don’t have a specific package identified, we can provide technical assistance to select the best package for your application.
IC Packaging Solutions
Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.
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