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Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC
IC Packages
Quik-Pak can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)®, Open Cavity Plastic Packages (OCPP)®, ceramic, laminate substrates and even custom package configurations.
If you don’t have a specific IC package identified, we can provide technical assistance to select the best package for your application.
IC Packaging Solutions
- Open-molded Plastic Packages (OmPP)
- Open Cavity Plastic Packages
- Ceramic Packages
- Laminate Substrates
- Custom Package Configurations
Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.
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