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Open-molded Plastic Packages (OmPP)
Quik-Pak can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)®, Open Cavity Plastic Packages (OCPP)®, ceramic IC packages, laminate substrates and even custom IC package configurations.
If you don’t have a specific IC package identified, we can provide technical assistance to select the best IC package for your application.
Custom IC Packaging Solutions
IC Packaging Solutions
- QFN Packages - Open-molded Plastic Packages (OmPP)
- Open-Tooled Over Molded QFN Packages
- Open Cavity Plastic Packages
- Ceramic IC Packages
- Laminate Substrates
- Custom IC Package Configurations