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CZT Detectors: Converging assembly technologies open new application opportunities

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IC Packages

Quik-Pak can provide virtually any package you need for your prototype devices, such as Open Cavity Plastic (OCPP), ceramic, laminate substrates and even custom package configurations.

If you don’t have a specific package identified, we can provide technical assistance to select the best package for your application.

IC Packaging Solutions

Open Cavity Plastic Packages
Ceramic Packages
Laminate Substrates
Custom Package Configurations

Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.