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Wire Bonding

Quik-Pak performs gold ball wire bonding utilizing the latest automatic equipment from Kulicke & Soffa and Essec, capable of handling wire diameters from 0.7 mil (17µm) to 3.0 mils (76µm) and bond pad pitch down to 35 microns.

Standard and ultra-fine pitch devices are easily accommodated, producing gold bonded parts in open cavity plastic or ceramic packages. Quik-Pak specializes in wire bonding advanced assembly components, including chip on board (COB), chip on flex, stacked or multiple die, and MEMS devices.

Quik-Pak also offers Aluminum wedge bonding with 1.0 mil (25µm) wire, and can even combine Gold and Aluminum bonding in the same device.

Quik-Pak can accommodate multiple bonding variations and encapsulation options within a single project, providing the flexibility to test different options for your new products.

To complete your devices and assist in identification, molded packages can be pad-print marked with a logo, part number and date code, as space allows.

Quik-Pak’s complete assembly solutions also include: