QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Encapsulation Options

After wire bonding, Quik-Pak offers several options for encapsulation of your devices, providing the level of protection and/or accessibility that you need. Options include:

Fully Closed

  • Flattened / Remolded: Packages are fully encapsulated with filled epoxy, utilizing Quik-Pak proprietary molding process. Packages are returned to their original mechanical state, meeting JEDEC standards and providing test socket compatibility.
  • Glob Top: Packages are fully encapsulated with filled epoxy and have a domed surface.
  • Clear Encapsulant: Packages are fully encapsulated with non-filled epoxy and have a domed surface, for bonding verification, visual samples and optical applications.

Partially Closed

  • Partial Encapsulation: Packages are encapsulated with filled epoxy in selected areas (i.e. around leads only.)

Open

  • Frames & Lids: No encapsulation. Custom frame around perimeter of package with removable lid to protect die and bond wires, yet provide complete accessibility.
  • Open Cavity: No encapsulation, die is exposed for total accessibility.

Quik-Pak also provides: