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Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

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Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

Encapsulation Options

After wire bonding, Quik-Pak offers several options for encapsulation of your devices, providing the level of protection and/or accessibility that you need. Options include:

Fully Closed

Flattened / Remolded: Packages are fully encapsulated with filled epoxy, utilizing Quik-Pak proprietary molding process. Packages are returned to their original mechanical state, meeting JEDEC standards and providing test socket compatibility.
Glob Top: Packages are fully encapsulated with filled epoxy and have a domed surface.
Clear Encapsulant: Packages are fully encapsulated with non-filled epoxy and have a domed surface, for bonding verification, visual samples and optical applications.

Partially Closed

Partial Encapsulation: Packages are encapsulated with filled epoxy in selected areas (i.e. around leads only.)

Open

Frames & Lids: No encapsulation. Custom frame around perimeter of package with removable lid to protect die and bond wires, yet provide complete accessibility.
Open Cavity: No encapsulation, die is exposed for total accessibility.

Additional Services offered by Quik-Pak include:

Datasheets

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