QUIK-PAK NEWS

Executive Outlook: A Perspective Look at 2012

Quik-Pak Announces Copper Wire Bonding Capability

Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family

Product/Service Spotlight

Quik-Pak offers QFN's with Largest Selection of 4mm Pitch

Request a Quote
Request OmPP™ Quote or Sample
Contact Customer Service
Customer Login

Open-molded Plastic Packages (OmPP)™

BGA Sphere (Ball) Attach

Quik-Pak utilizes state-of-the-art Hepco equipment and tooling to attach BGA spheres to your custom substrates. Substrates up to 44mm square are accommodated and spheres in sizes from 0.010" (0.25mm) to 0.030" (0.76mm) are available in both Sn/Pb and Pb-free alloys.

Quik-Pak can attach spheres to new substrates following die attach, wire bond and encapsulation steps, or can rework an existing substrate.

Quik-Pak’s complete assembly solutions also include:

Wire Bonding
Encapsulation Options
Marking/Branding
Flip Chip Assembly
Radiation Detector Fabrication/CZT
Laser Micromachining
Laminate Substrates