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Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

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Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

BGA Sphere (Ball) Attach

Quik-Pak utilizes state-of-the-art Hepco equipment and tooling to attach BGA spheres to your custom substrates. Substrates up to 44mm square are accommodated and spheres in sizes from 0.010" (0.25mm) to 0.030" (0.76mm) are available in both Sn/Pb and Pb-free alloys.

Quik-Pak can attach spheres to new substrates following die attach, wire bond and encapsulation steps, or can rework an existing substrate.

Quik-Pak’s complete assembly solutions also include: