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Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

New product and services video to view Click Here

Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

IC Assembly Services

Quik-Pak delivers complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, IC Packaging, Wire Bonding, Encapsulation, Flattening/Remolding, Marking/Branding and BGA sphere attach.

We continually make capital investments to ensure that the latest equipment and techniques are utilized to assemble your valuable devices.

Quik-Pak processes orders from a single part to thousands, and easily accommodates multiple variations within a single build.

Standard turn time for assembly services is 3 business days, but expedited turn times of 2 days, 1 day and even 8 hours are available for when your project timeline dictates.

Additional assembly services provided by Quik-Pak include: