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IC Assembly Services
Quik-Pak delivers complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, IC Packaging, Wire Bonding, Encapsulation, Flattening/Remolding, Marking/Branding and BGA sphere attach.
We continually make capital investments to ensure that the latest equipment and techniques are utilized to assemble your valuable devices.
Quik-Pak processes orders from a single part to thousands, and easily accommodates multiple variations within a single build.
Standard turn time for assembly services is 3 business days, but expedited turn times of 2 days, 1 day and even 8 hours are available for when your project timeline dictates.
Additional assembly services provided by Quik-Pak include: