QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

IC Assembly Services

Quik-Pak delivers complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding, Marking/Branding and BGA sphere attach. We continually make capital investments to ensure that the latest equipment and techniques are utilized to assemble your valuable devices.

Quik-Pak processes orders from a single part to thousands, and easily accommodates multiple variations within a single build.

Standard turn time for assembly services is 3 business days, but expedited turn times of 2 days, 1 day and even 8 hours are available for when your project timeline dictates.

Quik-Pak assembly services include: