QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Design & Engineering

Quik-Pak offers a range of design and engineering services to assist fabless semiconductor companies release new products to market.

Quik-Pak will design and fabricate substrates to your specifications, then complete the assembly process with your die, providing a complete turnkey solution for substrate-based assemblies, such as:

Quik-Pak can also design custom frames to protect your open cavity devices, provide artwork support for marking and assist with generation of bonding diagrams. Partner with Quik-Pak and make us an integral part of your new product introduction programs.