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Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Design & Engineering
Quik-Pak offers a range of design and engineering services to assist fabless semiconductor companies release new products to market.
Quik-Pak will design and fabricate substrates to your specifications, then complete the assembly process with your die, providing a complete turnkey solution for substrate-based assemblies, such as:Quik-Pak can also design custom frames to protect your open cavity devices, provide artwork support for marking and assist with generation of bonding diagrams. Partner with Quik-Pak and make us an integral part of your new product introduction programs.



