QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Flip Chip Bonding & Assembly

Flip Chip assembly is the direct electrical connection of face-down (flipped) electronic die onto organic or ceramic circuit boards by means of conductive bumps on the chip bond pads.  This process is quickly gaining popularity over traditional face-up wire bonding due to its advantages in circuit board real-estate reductions, performance, reliability, and cost over other packaging methods.

Quik-Pak enhances bonding capabilities

Quik-Pak has enhanced its Flip Chip bonding capability by installing a Finetech Pico Flip Chip bonder.  The bonder is capable of placing pre-bumped devices within a 1µm placement accuracy.  Assembly applications include µBGA, standard flip-chip, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.

Quik-Pak Offers:

Device Ball Bumping

    • Solder ball bump to 305µm (0.012") diameter on a 508µm (0.020") pitch
    • 96°C, 183°C, and 217°C alloys available 

    Device/Partial Wafer Stud Bumping:

    • Gold (Au) stud bumping of partial wafers and large die
    • Stud bumping pitch down to 150µm


    • Align down to 1µm placement accuracy
    • Placement and bonding down to 100µm pitch devices
    • Thermo-compression bonding of small gold-to-gold leads (highest accuracy)
    • Thermosonic bonding of gold-to-gold leads (lower temperature)
    • Hot air solder reflow for Sn, SnPb, and other solders
    • Underfills

    • Standard underfills for BGA and flip chip assemblies 
    • Reworkable underfills for BGA and flip chip assemblies where recovery of the substrate may be requiered