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Flip Chip Bonding

Flip Chip assembly is the direct electrical connection of face-down (flipped) electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. This process is quickly gaining popularity over face-up wire bonding due to its advantages in size, performance, flexibility, reliability, and cost over other packaging methods.

Quik-Pak Flip Chip assembly options provides:

* Faster time to market with your Flip Chip assembly project
* Optimal bump technology to meet your requirements
* Reduced footprint over traditional package assembly
* The higher speed electrical performance over any other assembly method
* The greatest I/O connection flexibility
* The most mechanically rugged interconnection method

Additionally Quik-Pak offers:

Bumping

* Solder ball bump to 254µm diameter
* Solder paste bump to 150µm pitch on small sections of silicon wafers (>75µm pad size)
* 96°C, 183°C and 217°C alloys available
* Gold (AU) stud bump partial wafers and larger die

Bonding:

* Use electrically conductive adhesives
* Align down t0 1µm
* Solder bumped Flip Chip - 150µm pitch
* Solder paste reflow
* Thermo-compression bond small gold-to-gold lead counts
* C4 Solder reflow of BGAs and Flip Chip bonding
* Tin (Sn) coated copper (Cu) Flip Chip bonding

Underfills

* Advanced fluxing underfills for 183° C and 217°C Flip Chip
* Standard post-reflow underfills for BGA and Flip Chip assemblies