QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Flip Chip Bonding

Flip Chip assembly is the direct electrical connection of face-down (flipped) electronic die onto organic or ceramic circuit boards by means of conductive bumps on the chip bond pads.  This process is quickly gaining popularity over traditional face-up wire bonding due to its advantages in circuit board real-estate reductions, performance, reliability, and cost over other packaging methods.

Quik-Pak enhances bonding capabilities

Quik-Pak has enhanced its Flip Chip bonding capability by installing a Finetech Lambda Flip Chip bonder.  The bonder is capable of placing pre-bumped devices within a 1µm placement accuracy.  Assembly applications include µBGA, standard flip-chip, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.

Quik-Pak Offers:

Device Ball Bumping

  • * Solder ball bump to 305µm (0.012") diameter on a 508µm (0.020") pitch
  • * 96°C, 183°C, and 217°C alloys available 

Device/Partial Wafer Stud Bumping: 

  • * Gold (Au) stud bumping of partial wafers and large die
  • * Stud bumping pitch down to 150µm

 Bonding:

  • * Align down to 1µm placement accuracy
  • * Placement and bonding of > 150µm pitch devices
  • * Thermo-compression bonding of small gold-to-gold leads (highest accuracy)
  • * Thermosonic bonding of gold-to-gold leads (lower temperature)
  • * C4 solder reflow to µBGAs and flip chips onto organic and ceramic substrates
  • * Tin (Sn) coated copper (Cu) posts or copper pillars for flip chip bonding of devices with  accurately controlled bondlines 

 Underfills

  • * Standard underfills for BGA and flip chip assemblies 
  • * Reworkable underfills for BGA and flip chip assemblies where recovery of the substrate may be requiered