Advanced Assembly
Chip on Board (COB) / Chip on Flex (COF)
Quik-Pak has the capability to attach and bond die on printed circuit boards and flex circuits measuring up to 5" by 8" and even larger, using our range of wire bond equipment. Passive components can be mounted and die protected with encapsulation, frame and lid or custom covers. Quik-Pak also has the capability of designing unique fixtures for your populated boards.
Multi-Chip Module (MCM) / System in Package (SiP)
Quik-Pak’s flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.
Flip Chip Bonding
When you are ready to make the move to Flip Chip technology, Quik-Pak offers complete Prototype Assembly Services, including Wafer/Die Bumping, Die Placement, Solder Reflow, Underfill, Encapsulation and Substrate Ball Attach. Quik-Pak also provides substrate design and manufacturing services to deliver a complete turnkey Flip Chip solution.
Stacked Die
When your device requires the integration of multiple components in a single package, such as ASIC and memory die, a stacked die assembly delivers the smallest footprint and most economical solution. Quik-Pak’s unique ability to backgrind individual die enables the finished devices to meet original JEDEC package thickness specifications, and our capabilities in die attach and wire bonding, including die to die and die to substrate bonding, enable prototype assembly of your complicated stacked die devices.
MEMS
Quik-Pak’s unique assembly techniques provides the capability to assemble unique MEMS devices, including chemical, environmental and pressure sensors and other configurations requiring an air cavity. Our laser micromachining system allows the creation of custom packages and assemblies, with frames, lids and covers to protect your delicate devices.
Radiation Detector Fabrication
Quik-Pak offers custom design and fabrication of gamma-radiation sensors, utilizing Cadmium Zinc Telluride (CZT) crystals, which can be designed into products for homeland security, medical imaging and astrophysical applications.
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Thermal Calibration Chip (TCC) Fabrication
Also known as Thermal Test Vehicles (TTVs), Quik-Pak can embed a thermocouple or RTD in any open cavity package to be used as a thermal calibration tool for equipment such as burn-in or other types of ovens, environmental test handlers, etc.
