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We Sell Time, Not
Just Services
Quik-Pak understands that new I.C. designs drive company growth. We understand that time to market is critical to the design engineer and his organization. Quik-Pak's patented Open-Cavity technology and complementary assembly services provide leading semiconductor companies worldwide, as well as Fabless companies, with a strategic advantage for their I.C. design program. Quik-Pak's employee's understand the value of each order, take pride in product quality and always have full customer satisfaction in mind. When your order is placed, you can be assured that it will be processed based on your turn time, with unmatched service.
Quik-Pak Background
The company was founded under the name of SPT in 1994. In June 1994, SPT patented its open-cavity plastic package technology, and shortly thereafter commenced operations in Poway, California.
Often referred to as the “scoop and goop” process, this term creatively describes the company's method for removing the old die from a plastic IC package (scoop), then wire bonding and encapsulating a new die into the same package (goop).
The company and its reputation grew and in July 2000 Gel-Pak acquired SPT and the division was named Quik-Pak.
Continuing to grow, Quik-Pak built its current, state of the art facility in the fall of 2000. Since then, it has expanded its IC Assembly capability and service offerings to include fine pitch assembly, wafer saw and back grind support.
In 2003 Quik-Pak introduced a revolutionary Assembled prototype unit. This “remolded” unit has become popular with IC Design/Verification teams as it will fit perfectly into test sockets and onto test boards. Quik-Pak's open cavity prototype packages have also provided a means for rapid and low cost MEMS design verification.
Today Quik-Pak has hundreds of IDM and Fabless customers worldwide.
Quik-Pak Value Proposition
Quik-Pak is the ideal solution for rapid, accurate and cost effective prototyping of New IC Designs. read more
Quik-Pak Supports MEMS Companies
Quik-Pak is pleased to introduce a range of services to support Micro Electro Mechanical Systems (MEMS) companies. The services include Engineering Support, Package Design & Development, Prototypes - Packages and Assembly, as well as unique requests. read more
Solving the Packaging Design Dilemma
How Do Chip Designers and Package Designers Work Together Now And In The Future read more
A Division of Delphon Industries
In August of 2004, Quik-Pak and Gel-Pak were reorganized under the umbrella of a new parent company, Delphon Industries, in order to create a platform for future growth. New growth capital was raised in partnership with Sverica International, a San Francisco-based private equity firm.
The reorganization enables clear branding of each division's products and services as well as positioning the company for expansion. “Our growth plans include more acquisitions and by positioning Delphon Industries as our platform, it allows us to strategically build the brands of all our separate divisions, now and in the future,” said Delphon CEO Jeanne Beacham.
“I'm very excited about our business opportunities and partnering with Sverica International gives us access to additional capital to execute both acquisitions and organic growth.” With the solid and forward thinking leadership of CEO Beacham, combined with the strong financial umbrella of Delphon Industries, Quik-Pak is strongly positioned for the future.
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Ph: 858 674-4676
