Quik-Pak, specializes in advanced IC Assembly and Prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The company offers Packaging and Assembly services in 24 hours or less. Quik-Pak also offers complete Wafer & Die Preparation services, including Backgrinding, Dicing, Bumping, Pick & Place and Inspection.
The company’s Advanced Assembly services meet the unique requirements for Flip Chip, Chip-on-Board (COB), Stacked Die, Multi-Chip Module (MCM), System-in-Package (SIP), Ceramic, BGA and MEMS devices. Custom Assembly services include Die Bonding, Gold Wire Ball Bonding, Encapsulation & Remolding and Marking. Quik-Pak’s Laser Micromachining capability creates vast opportunities for package customization through drilling, cutting and marking of almost any material. Quik-Pak is the ideal partner for Advanced IC Assembly and Prototyping, providing unparalleled flexibility, quality and outstanding customer service.
PROMEX is a unique materials-centric Electronics and IC Assembly Service with comprehensive capabilities spanning wafer prep, IC assembly, full SMT for mixed assembly, SIP and hybrid manufacturing based in Santa Clara, California, the heart of Silicon Valley.
The highest quality standards are supported using SPC in a Quick turn manufacturing environment.
Promex has been ISO certified since 1999, is ITAR registered for the military market as well as ISO 13485 certified for Medical product assembly.