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Quik-Pak, a division of Delphon, provides prototype and volume IC packaging and IC a
- Open-molded Plastic QFN Packages (OmPP) and Open Cavity Plastic Packages (OCPP)
- Custom molded QFN packages available in high volume
- Die/wire bonding, encapsulation, marking/branding
- IC assembly services for flip chip, ceramic packages, chip-on-board, stacked die and MEMS
- Wafer preparation - wafer dicing, wafer backgrinding, die sorting
- Advanced VCSEL Assembly experience.
The company’s newest offering is its QFN package a Open-molded plastic package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.