Same Day Packaging and Custom Assembly Services for Faster Time to Market

• Specializing in advanced IC Assembly and quick-turn Prototyping
• Enables faster time to market for new devices
• Delivers IC Prototypes to specification and on schedule
• Open Cavity Plastic Packages (OCPP) from our inventory or yours
• Flip Chip, Chip-on-board (COB), Stacked Die Assembly
• System-in-Package (SIP), Multi-Chip Module (MCM) Assembly
• Ceramic, BGA, and MEMS assembly
• Backgrinding, Dicing, Bumping, Pick & Place
• Die Bonding, Gold Wire Bonding, Encapsulation, Remolding, Marking