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Quik-Pak News

Quik-Pak Promotes Casey Krawiec to Global Sales and Marketing Director

Quik-Pak Selected to Provide Enhanced Molding and Assembly Services

Delphon Partners
with Fulham & Co.

Faster Time to Market for IC's

Quik-Pak, a division of Delphon, provides prototype and volume IC packaging and IC assembly services. The company specializes providing a full turn-key solution that helps get your design to market quickly.

Quik-Pak offers

Open-molded Plastic QFN Packages (OmPP) and Open Cavity Plastic Packages (OCPP)
Custom molded QFN packages available in high volume
Die/wire bonding, encapsulation, marking/branding
IC assembly services for flip chip, ceramic packages, chip-on-board, stacked die and MEMS
Wafer preparation - wafer dicing, wafer backgrinding, die sorting
Advanced VCSEL Assembly experience.
Air Cavity QFN Packages

The company’s newest offering is its QFN package a Open-molded plastic package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.

WAFER PREPARATION

IC PACKAGING

IC ASSEMBLY