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Quik-Pak News

Quik-Pak Selected to Provide Enhanced Molding and Assembly Services to Wireless Semiconductor and Solar Customers

Delphon Partners
with Fulham & Co.

Delphon Appoints Rajesh Varma to Chief Technology Officer

Same Day Packaging and Custom Assembly Services

Quik-Pak, a division of Delphon, provides IC Packaging and Assembly services. The company specialize in a variety of services that together provide a full turn-key solution including wafer preparation, die attach, wire bonding, remolding and marking/branding.  Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die and MEMS.

• Specializing in advanced IC Packages, IC Assembly, Advanced Assembly and Quickturn Prototyping
• QFN Packages - Open-molded Plastic Packages (OmPP)® QFN packages
  stocked for immediate shipment
• Open Cavity Plastic Packages (OCPP)® from our inventory or yours
• Flip Chip, Wirebond, selective Stud Bump and Solder Ball Attach
• Custom organic Laminate Substrates and Interposers
• Assembly expertise with Ceramic /BGA / MCM / COB / COF / SIP
• Versatile Assembly and Wafer Processing Services
• Advanced VCSEL Assembly experience.
  
  

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  NEW Air Cavity QFN Packages

  The company’s newest offering is its QFN package a Open-molded plastic package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.

  Air Cavity QFN Packages

  • Custom QFN Packages
  • Mid-volume Assembly Services
  • Custom QFN Package Lids
  • Largest Selection of 0.40mm Pitch QFN Packages