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Faster Time to Market for ICs
Quik-Pak, a division of Promex Industries, provides prototype and volume IC packaging and IC assembly services. The company specializes providing a full turn-key solution that helps get your design to market quickly.
- Air Cavity Plastic QFN Packages (OmPP) and Open Cavity Plastic Packages (OCPP)
- Plastic Over Molded QFN – open-tooled
- Die/wire bonding , encapsulation, marking/branding
- IC assembly services for flip chip, ceramic packages, chip-on-board, stacked die and MEMS
- Wafer preparation - wafer dicing, wafer backgrinding, die sorting
- Advanced VCSEL Assembly experience
Air Cavity QFN Packages
The company’s newest offering is its QFN package, the Open-molded Plastic Package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.