QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Same Day Packaging and Custom Assembly Services for Faster Time to Market

  • Specializing in advanced IC Assembly and quick-turn Prototyping
  • Enables faster time to market for new devices
  • Delivers IC Prototypes to specification and on schedule
  • Open Cavity Plastic Packages (OCPP) from our inventory or yours
  • Flip Chip, Chip-on-board (COB), Stacked Die Assembly
  • System-in-Package (SIP), Multi-Chip Module (MCM) Assembly
  • Ceramic, BGA, and MEMS assembly
  • Backgrinding, Dicing, Bumping, Pick & Place
  • Die Bonding, Gold Wire Bonding, Encapsulation, Remolding, Marking