QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Same Day IC Packaging and Custom Assembly Services

Quik-Pak, a division of Delphon, provides IC packaging and IC assembly services. The company specialize in a variety of services that together provide a full turn-key solution including wafer preparation, die attach, wire bonding, remolding and marking/branding.  Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die and MEMS.