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Product Spotlight

Overmolded Packages

Faster Time to Market for ICs

Quik-Pak, a division of Promex Industries, provides prototype and volume IC packaging and IC assembly services. The company specializes providing a full turn-key solution that helps get your design to market quickly.

Quik-Pak offers

• Air Cavity Plastic QFN Packages (OmPP) and Open Cavity Plastic Packages (OCPP)
• Plastic Overmolded QFN – open-tooled
• Die/wire bonding , encapsulation, marking/branding
• IC assembly services for flip chip, ceramic packages, chip-on-board, stacked die and MEMS
• Wafer preparation - wafer dicing, wafer backgrinding, die sorting
• Advanced VCSEL Assembly experience

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Air Cavity QFN Packages

The company’s newest offering is its QFN package, the Open-molded Plastic Package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.

• Custom QFN Packages
• Mid-volume Assembly Services
• Custom QFN Package Lids
• Largest Selection of 0.40mm Pitch QFN Packages

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Quik-Pak News

Quik-Pak Relocates to Larger, Customized Facility

Quik-Pak Announces Substrate Development Service

Quik-Pak Acquires Wafer-Preparation Firm QBBS

Quik-Pak Names Ken Molitor Chief Operating Officer

Promex Quik-Pak Return to IEEE Long Island RF/Microwave Symposium with Quick-Turn Air Cavity QFNs for Microwave, Millimeter Wave and RF Applications

Promex and Quik-Pak Employees Donate Truckloads of Gifts to Toys R Tots

Promex Quik-Pak Features Air Cavity Plastic and Overmolded QFNs at Electronic Packaging Symposium

Quik-Pak Exhibits Prototype Services for RF Devices and Sensors Supporting 5G and IoT

Promex Quik-Pak Exhibits Air Cavity Plastic and Overmolded QFNs at IEEE MTT IMS

Quik-Pak Exhibits Prototype Services for RF Devices and Sensors Supporting 5G and IoT at ECTC

Five-Day Delivery of Overmolded QFNs from Quik-Pak San Diego

More Quik-Pak News