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Product Spotlight
Overmolded Packages
Faster Time to Market for ICs
Quik-Pak, a division of Promex Industries, provides prototype and volume IC packaging and IC assembly services. The company specializes providing a full turn-key solution that helps get your design to market quickly.
Quik-Pak offers
- Air Cavity Plastic QFN Packages (OmPP) and Open Cavity Plastic Packages (OCPP)
- Plastic Overmolded QFN – open-tooled
- Die/wire bonding , encapsulation, marking/branding
- IC assembly services for flip chip, ceramic packages, chip-on-board, stacked die and MEMS
- Wafer preparation - wafer dicing, wafer backgrinding, die sorting
- Advanced VCSEL Assembly experience
Air Cavity QFN Packages
Air Cavity and Overmolded QFN Packages The company’s newest offering is its QFN package, the Open-molded Plastic Package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.
- Custom QFN Packages
- Mid-volume Assembly Services
- Custom QFN Package Lids
- Largest Selection of 0.40mm Pitch QFN Packages
Quik-Pak News
Quik-Pak Announces Substrate Development Service
Quik-Pak Acquires Wafer-Preparation Firm QBBS
Quik-Pak Names Ken Molitor Chief Operating Officer
Promex and Quik-Pak Employees Donate Truckloads of Gifts to Toys R Tots
Promex Quik-Pak Features Air Cavity Plastic and Overmolded QFNs at Electronic Packaging Symposium
Quik-Pak Exhibits Prototype Services for RF Devices and Sensors Supporting 5G and IoT
Promex Quik-Pak Exhibits Air Cavity Plastic and Overmolded QFNs at IEEE MTT IMS
Quik-Pak Exhibits Prototype Services for RF Devices and Sensors Supporting 5G and IoT at ECTC
Five-Day Delivery of Overmolded QFNs from Quik-Pak San Diego
WAFER PREPARATION
IC PACKAGING
IC ASSEMBLY
