Quick Links

Product Spotlight

Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!

Quik-Pak News

Quik-Pak expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

Technical Article: The Right Tool for the Job

Quik-Pak Announces Copper Wire Bonding Capability

Same Day Packaging and Custom Assembly Services

Quik-Pak, a division of Delphon Industries, provides IC Packaging and Assembly services. The company specialize in a variety of services that together provide a full turn-key solution including wafer preparation, die attach, wire bonding, remolding and marking/branding. Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die and MEMS.  

• Specializing in advanced IC Packages, IC Assembly, Advanced Assembly and Quickturn Prototyping
• Open Cavity Plastic Packages (OCPP)® from our inventory or yours
• Open-molded Plastic Packages (OmPP)® QFN's stocked for immediate shipment
• Flip Chip, Wirebond, selective Stud Bump and Solder Ball Attach
• Custom organic Laminate Substrates and Interposers
• Assembly expertise with Ceramic / BGA / MCM / COB / COF / SIP
• Versatile Assembly and Wafer Processing Services
• Advanced VCSEL Assembly experience.

  The company’s newest offering is its OmPP package. These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.

  

  NEW Air Cavity QFN Open-molded Plastic Packages

  • Custom OmPP Packages
  • Mid-volume Assembly Services
  • Custom OmPP lids
  • Largest Selection of 0.40mm Pitch QFN's