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Same Day Packaging and Custom Assembly Services
Quik-Pak, a division of Delphon Industries, provides IC Packaging and
- Specializing in advanced IC Packages, IC Assembly, Advanced Assembly and Quickturn Prototyping
- Open Cavity Plastic Packages (OCPP)® from our inventory or yours
- Open-molded Plastic Packages (OmPP)® QFN's stocked for immediate shipment
- Flip Chip, Wirebond, selective Stud Bump and Solder Ball Attach
- Custom organic Laminate Substrates and Interposers
- Assembly expertise with Ceramic / BGA / MCM / COB / COF / SIP
- Versatile Assembly and Wafer Processing Services
- Advanced VCSEL Assembly experience.
The company’s newest offering is its OmPP package. These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.