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Overmolded Packages

Quik-Pak News

• Quik-Pak Installs New QFN Production Line in San Diego
• Quik-Pak, Promex Promote Advanced Packaging, Heterogeneous Assembly
• Quik-Pak Exhibits Air Cavity Plastic QFNs, Overmolded QFNs

More Quik-Pak News

Faster Time to Market for ICs

Quik-Pak, a division of Promex Industries, provides prototype and volume IC packaging and IC assembly services. The company specializes providing a full turn-key solution that helps get your design to market quickly.

Quik-Pak offers

• Air Cavity Plastic QFN Packages (OmPP) and Open Cavity Plastic Packages (OCPP)
• Plastic Overmolded QFN – open-tooled
• Die/wire bonding , encapsulation, marking/branding
• IC assembly services for flip chip, ceramic packages, chip-on-board, stacked die and MEMS
• Wafer preparation - wafer dicing, wafer backgrinding, die sorting
• Advanced VCSEL Assembly experience

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Air Cavity QFN Packages

The company’s newest offering is its QFN package, the Open-molded Plastic Package (OmPP). These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype, mid-volume or production volume applications.

• Custom QFN Packages
• Mid-volume Assembly Services
• Custom QFN Package Lids
• Largest Selection of 0.40mm Pitch QFN Packages